Smart Photography India`s No 1 Imaging Magazine

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Nikon receives order from Intel for next-gen wafers

May 7, 2013 by spwordpress

Nikon Corp. has received an order from Intel Corp. for a next-generation stepper capable of creating circuit patterns on 450mm silicon wafers.

It is to supply a prototype to Intel in 2015 for roughly 6 billion yen (US$63.16 M). This price tag is about 30% higher than that for current steppers, which are designed to handle silicon wafers 300mm in diameter. But increasing the diameter 50% to 450mm is expected to enable Intel to halve the cost of making the most sophisticated chips. Nikon is expected to supply mass- production versions of the stepper in around 2017, with total shipments forecast to reach tens of billions of yen.



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